Gain insight into Winbond Electronics’ HyperRAM™ alternative memory option. In this article, you can explore the features and benefits of Winbond’s expanded portfolio, including latest 32Mb, 64Mb, and 128Mb densities that are now available for automotive, industrial 4.0, smart home, and wearable markets.
HyperRAM™ is a new technical solution which supports the HyperBus™ interface. The first generation of it offers a throughput up to 333 MB/s, and HyperRAM™ 2.0 made it possible to boost up to 400 MB/s.
Winbond Electronics and Cypress have teamed up to create HyperRAM™ 2.0, a new technical solution that supports the HyperBus™ interface. This first-generation product offers a throughput up to 333 MB/s, and HyperRAM™ 2.0 made it possible to boost up to 400 MB/s. Currently, products of 24BGA (6x8 mm2) with automotive grade, 49BGA (4x4 mm2) and WLCSP (Wafer Level Chip Scale Package) with targeting consumer wearable market, and KGD (Known Good Die) are all available.
Learn more about the technical aspects, benefits and application uses of HyperRAM™ in this article from Winbond.
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